Method of manufacturing semiconductor device and semiconductor device

ABSTRACT

A performance of a semiconductor device is improved. A method of manufacturing a semiconductor device according to one embodiment includes a step of mounting a cover member via a bonding material on an upper surface of a frame member fixed on a wiring substrate, and a step of curing the bonding material by irradiating the bonding material mounted on the frame member with an ultraviolet ray. The wiring substrate has a base member and an insulating film covering the base member, and the frame member and a semiconductor chip are mounted (fixed) onto an upper surface of the insulating film. The frame member contains glass fibers. Moreover, a roughness of the upper surface of the frame member is equal to or less than a roughness of the upper surface of the insulating film.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese Patent ApplicationNo. 2016-178444 filed on Sep. 13, 2016, the content of which is herebyincorporated by reference into this application.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a method of manufacturing asemiconductor device and a semiconductor device, and relates to atechnique effectively applied to a semiconductor device in which asemiconductor chip mounted on a substrate is covered with a covermember.

BACKGROUND OF THE INVENTION

Japanese Patent Application Laid-open Publication No. 2013-243341(Patent Document 1) has described an electronic component in which anelectronic device mounted on a substrate is covered with a frame memberand a cover member. Further, Patent Document 1 has described aphotocurable resin, a thermosetting resin or others, as examples of ajoining material for bonding the frame member and the cover member.

Moreover, Japanese Patent Application Laid-open Publication No.2002-289718 (Patent Document 2) has described a solid-state image pickupapparatus in which a solid-state image pickup element mounted on asubstrate is covered with a frame member and a cover member. PatentDocument 2 has described that an upper surface of the frame member andthe cover member are bonded to each other via an ultraviolet-ray curableresin. In Patent Document 2, a glass epoxy resin is included inexemplified materials for the frame member.

Furthermore, Japanese Patent Application Laid-open Publication No.2012-217021 (Patent Document 3) has described a solid-state image pickupapparatus in which a solid-state image pickup element mounted on asubstrate is covered with a frame member and an optical member (covermember). Patent Document 3 has described that the frame member and thesubstrate are bonded to each other by a thermosetting resin and that theframe member and the optical member are bonded to each other by anultraviolet-ray curable resin.

SUMMARY OF THE INVENTION

For example, as a packaging mode of an image sensor or others, asemiconductor device in which a semiconductor chip mounted on a wiringsubstrate is covered with a cover member such as a glass plate has beenproposed. When a semiconductor chip having a light-receiving part suchas an image sensor is used, the following configurations are requiredfor the semiconductor device. That is, the configurations are aconfiguration capable of irradiating the light-receiving part withvisible light and a configuration of protecting the semiconductor chipfrom an external force.

As a structure functioning as both of the above-described twoconfigurations, the following semiconductor device is preferable. Thatis, the semiconductor chip is mounted inside the frame member fixed tothe wiring substrate, that is, within a region surrounded by the framemember when seen in a plan view. Moreover, the semiconductor chip iscovered with a cover member that is fixed onto the frame member and thatis comprised of a visible light transmissive material such as a glassplate. In the semiconductor device having the above-described structure,the frame member and the cover member can be independently manufactured,and therefore, the semiconductor device is also preferable in terms ofproduction efficiency.

However, according to studies by the inventor of the present invention,it has been found that even the semiconductor device having theabove-described structure has still some room for improvements in termsof enhancing the reliability of the product and others. For example, inthe structure in which the frame member and the cover member are fixedonto the wiring substrate, if a bonding material and a member are peeledoff from each other at a part of a bonding interface between therespective members, the peeling off becomes a cause of reduction in thereliability of the semiconductor chip in some cases.

Other object and novel characteristics will be apparent from thedescription of the present specification and the accompanying drawings.

A method of manufacturing a semiconductor device according to oneembodiment includes a step of fixing, via a bonding material, a covermember onto an upper surface of a frame member fixed on a wiringsubstrate, and a step of curing the bonding material by irradiating thebonding material fixed on the frame member with ultraviolet ray. Theabove-described wiring substrate is provided with a base member and aninsulating film covering the base member, and the frame member and asemiconductor chip are fixed on an upper surface of the insulating film.The above-described frame member contains glass fibers. Moreover,roughness of the upper surface of the frame member is the same asroughness of the upper surface of the insulating film, or is smallerthan the roughness of the upper surface of the insulating film.

According to the above-described embodiment, a performance of thesemiconductor device can be improved.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a plan view of a semiconductor device according to oneembodiment;

FIG. 2 is a plan view showing an internal structure of the semiconductordevice shown in FIG. 1;

FIG. 3 is a cross-sectional view taken along a line A-A of FIG. 1;

FIG. 4 is an enlarged cross-sectional view of a periphery of a framemember shown in FIG. 3;

FIG. 5 is an enlarged cross-sectional view of an upper surface of aframe member according to a study example relative to the embodiment;

FIG. 6 is an enlarged cross-sectional view of an upper surface and alower surface of the frame member shown in FIG. 4;

FIG. 7 is an explanatory view showing an assembly flow of thesemiconductor device shown in FIG. 1 to FIG. 4;

FIG. 8 is a plan view of a wiring substrate to be prepared in a wiringsubstrate preparation process shown in FIG. 7;

FIG. 9 is a cross-sectional view taken along a line A-A of FIG. 8;

FIG. 10 is an explanatory view showing one example of a detailed flow ofa frame-member assembly process shown in FIG. 7;

FIG. 11 is an explanatory view showing one example of a detailed flow ofthe frame-member assembly process, continued from FIG. 10;

FIG. 12 is a plan view showing a state in which the frame member ismounted on the wiring substrate in a frame-member mounting process shownin FIG. 7;

FIG. 13 is a cross-sectional view showing a state in which asemiconductor chip is mounted on the wiring substrate shown in FIG. 9;

FIG. 14 is a cross-sectional view showing a state in which wires areconnected to the semiconductor chip and the wiring substrate shown inFIG. 13;

FIG. 15 is a cross-sectional view showing a state in which a bondingmaterial is applied onto the frame member shown in FIG. 14;

FIG. 16 is a cross-sectional view showing a state in which a covermember is mounted on the frame member shown in FIG. 15, and is thenirradiated with ultraviolet ray;

FIG. 17 is a cross-sectional view showing a state in which solder ballsare joined to terminals shown in FIG. 16;

FIG. 18 is a cross-sectional view showing a modified example of theframe member shown in FIG. 6;

FIG. 19 is an enlarged cross-sectional view of a periphery of the framemember included in the semiconductor device of the present embodimentaccording to a modified example of FIG. 4;

FIG. 20 is an enlarged cross-sectional view of an upper surface and alower surface of the frame member shown in FIG. 19;

FIG. 21 is an enlarged cross-sectional view of peripheries of the uppersurface and the lower surface of the frame member included in thesemiconductor device according to a modified example of FIG. 20;

FIG. 22 is an enlarged cross-sectional view of peripheries of the uppersurface and the lower surface of the frame member included in thesemiconductor device according to another modified example of FIG. 20;and

FIG. 23 is an enlarged cross-sectional view of peripheries of the uppersurface and the lower surface of the frame member included in thesemiconductor device according to still another modified example of FIG.20.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS Explanation of DescriptionForm, Basic Term and Method in Present Application

In the present application, the embodiments will be described in aplurality of sections or others if needed when required as a matter ofconvenience. However, these sections or embodiments are not irrelevantto each other unless otherwise stated, and each part or one of oneexample relates to a specific part, apart or the entire of the otherexample as a modification example or others, regardless of before andafter the description. Also, in principle, the repetitive description ofthe same part is omitted. Further, each element in the embodiment is notindispensable unless otherwise described to be particularly so,logically limited to the number, and described to be clearly so from thecontexts.

Similarly, even when “X comprised of A” or others is described formaterials, compositions, and others in the description of the embodimentand others, the one containing other components than A is not eliminatedunless otherwise specified and clearly to be so from the contexts. Forexample, as to the component, “X comprised of A” means “X containing Aas a main component” or others. For example, the component means “Xcontaining A as a main component” or others. For example, it is needlessto say that a “silicon material” and others includes not only puresilicon but also SiGe (silicon germanium) or other multicomponent alloycontaining silicon as a main component, or a member containing otheradditives or others. Also, gold plating, a Cu layer, nickel plating, andothers include not only pure material but also members containing gold,Cu, nickel, and others as a main component, respectively, unlessotherwise specified not to be so.

Further, even when a specific numerical value and numerical amount arementioned, they may be numerical values that excess the specificnumerical values or smaller than the specific numerical values unlessotherwise specified not to be so, logically limited to the number, andclearly described to be so from the contents.

Still further, in each drawing of the embodiment, the same or similarparts are denoted by the same or similar symbol or reference number, andthe description thereof is not repeated.

Moreover, in the present application, a term “upper surface” or “lowersurface” is used in some cases. However, since the packaging mode of thesemiconductor package includes various modes, for example, the uppersurface is arranged to be lower than the lower surface after packagingthe semiconductor package in some cases. In the present application,explanations will be made in an assumption that a packaged surface forthe semiconductor package is the lower surface and that an oppositesurface to the packaged surface is the upper surface.

Also, in the attached drawings, hatching or others is omitted even in across-sectional view in a conversely complicated case or in a case inwhich a space is clearly distinguished therefrom. In respect to this, ina case in which it is clear from the description or others, an outlineof the background is omitted even in a hole which is closed in a planview. Further, hatching or a dot pattern is added to a drawing even ifthe drawing is not a cross-sectional view in order to explicitlyillustrate so as not to be the space or explicitly illustrate a boundarybetween regions.

First Embodiment

In the present embodiment, as an example of a semiconductor device inwhich a semiconductor chip is mounted on a wiring substrate and which issurrounded by a frame member and a cover member, an image sensor packagein which a semiconductor chip serving as an image sensor is mounted on awiring substrate will be exemplified and explained.

<Semiconductor Device>

First, referring to FIG. 1 and FIG. 3, a configuration of asemiconductor device PKG1 according to the present embodiment will beexplained. The semiconductor device PKG1 according to the presentembodiment is provided with a wiring substrate WB and a semiconductorchip CP mounted on the wiring substrate WB. FIG. 1 is a plan view of thesemiconductor device according to the present embodiment, and FIG. 2 isa plan view showing an internal structure of the semiconductor deviceshown in FIG. 1. Moreover, FIG. 3 is a cross-sectional view taken alonga line A-A of FIG. 1. FIG. 4 is an enlarged cross-sectional view of aperiphery of a frame member shown in FIG. 3. Note that FIG. 2 and FIG. 3show a region of a light-receiving part formed on a front surface CPtside of the semiconductor chip CP, the region being surrounded by atwo-dot chain line and denoted by a symbol LRP. Furthermore, in FIG. 2,illustrations of a cover member CVG and a bonding material BND2 forfixing the cover member CVG onto a frame member FLP shown in FIG. 3 areomitted. FIG. 4 schematically shows glass fibers GC contained in theframe member FLP, and hatching of the frame member FLP is omitted.

As shown in FIG. 1 to FIG. 3, the semiconductor device PKG1 of thepresent embodiment has the wiring substrate WB and the frame member(support member, spacer, dam) FLP that is fixed onto the wiringsubstrate WB. Moreover, the semiconductor device PKG1 has thesemiconductor chip CP (see FIG. 2 and FIG. 3) mounted inside the framemember FLP and the cover member (glass plate, transparent plate) CVG(see FIG. 1 and FIG. 3) fixed on the frame member FLP such that thesemiconductor chip CP is covered.

As shown in FIG. 3, the wiring substrate (substrate) WB has an uppersurface WBt serving as a chip mounting surface and a lower surface WBbthat is opposite to the upper surface WBt and that serves as a packagingsurface. In the present embodiment, each of the upper surface WBt andthe lower surface WBb has a square shape. Moreover, the wiring substrateWB has the base member BSP containing an insulating material, aninsulating film (solder resist film) SR1 covering the upper surface BSPtof the base member BSP and an insulating film (solder resist film) SR2covering the lower surface BSPb of the base member BSP.

The base member BSP has an upper surface (surface, main surface) BSPtand a lower surface (surface, main surface) BSPb located opposite to theupper surface BSPt. The base member BSP is a member comprised of aninsulating material, and has, for example, a single layer structure inan example shown in FIG. 3. The insulating layer forming the base memberBSP has glass fibers. More specifically, the insulating film is formedby, for example, curing a so-called prepreg material formed byimpregnating a glass fiber sheet with an epoxy-based thermosettingresin. The insulating material formed by curing the prepreg material isreferred to as “glass epoxy” in some cases. When the base member BSPcontains the glass fibers, the strength of the wiring substrate WB canbe improved. Note that the base member BSP of the wiring substrate WBshown in FIG. 3 is an insulating layer having a single layer structure,and includes various applicable modified examples. For example, the basemember BSP may have a structure in which a plurality of insulatinglayers and a plurality of wiring layers are alternately stacked. In thiscase, the number of wiring layers included in the wiring substrate WBcan be made such that a multi-layer structure is provided. Moreover,when the base member BSP has a plurality of insulating layers, some ofthe plurality of insulating layers may contain the glass fibers, and theother may not contain the glass fibers. Furthermore, depending on thestrength required for the wiring substrate WB, the insulating layersforming the base member BSP may not contain the glass fibers in somecases.

Moreover, on the upper surface BSPt of the base member BSP, a pluralityof terminals (bonding leads, wire connecting parts) BL and an insulatingfilm (solder resist film, protective film) SR1 are disposed. Theinsulating film SR1 is an insulating film covering most of the uppersurface BSPt of the base member BSP, and has a lower surface (surface,main surface, rear surface) SR1 b that faces to the upper surface BSPtand an upper surface (surface, main surface, front surface) SR1 t thatis opposite to the lower surface SR1 b as shown in FIG. 3. Theinsulating film SR1 functions as a protective film for protecting awiring pattern formed on the uppermost surface of the wiring substrateWB. Since the insulating film SR1 is the film formed on the uppermostsurface of the wiring substrate WB, the upper surface SR1 t of theinsulating film SR1 serves as also the upper surface WBt of the wiringsubstrate WB.

Moreover, an opening is formed in the insulating film SR1. From theopening, the plurality of terminals BL are exposed. Each terminal BL isan internal interface terminal of the semiconductor device PKG1 to beconnected to the semiconductor chip CP via the wire BW. The plurality ofterminals BL are each comprised of a metal material such as copper, andare a patterned conductor pattern. Furthermore, in an example shown inFIG. 2, the plurality of terminals BL are arranged on the periphery ofthe semiconductor chip CP. Note that the example shown in FIG. 2 shows acase in which the openings for individually exposing the plurality ofterminals BL respectively therefrom are formed on the insulating filmSR1. However, a size and a shape of the opening includes variousmodified examples. For example, a large opening for collectivelyexposing the plurality of adjacent terminals BL therefrom may be formedin the insulating film SR1.

Furthermore, as shown in FIG. 3, on the lower surface BSPb of the basemember BSP, a plurality of terminals (lands, solder ball connectingparts) LD and an insulating film (solder resist film, protective film)SR2 are disposed. The insulating film SR2 is an insulating film coveringmost of the lower surface BSPb of the base member BSP, and has an uppersurface (surface, main surface, front surface) SR2 t that faces to thelower surface BSPb and a lower surface (surface, main surface, frontsurface) SR2 b that is opposite to the upper surface SR2 t as shown inFIG. 3. The insulating film SR2 functions as a protective film forprotecting a wiring pattern formed on the lowermost surface of thewiring substrate WB. Since the insulating film SR2 is the film formed onthe lowermost layer of the wiring substrate WB, the lower surface SR2 bof the insulating film SR2 serves as also the lower surface WBb of thewiring substrate WB.

Moreover, an opening is formed in the insulating film SR2. From theopening, the plurality of terminals LD are exposed. Each terminal LD isan external interface terminal of the semiconductor device PKG1 to beconnected to an external device of the semiconductor device PKG1 via thesolder ball SB. The plurality of terminals LD are each comprised of ametal material such as copper, and are a patterned conductor pattern.The terminals LD are electrically connected to the terminals BL formedon the upper surface BSPt via a wiring (interlayer conductor path,through hole wiring, via wiring) THW that is an interlayer conductivepath for electrically connecting the wiring layer of the upper surfaceBSPt and the wiring layer of the lower surface BSPb of the base memberBSP. The plurality of terminals LD and the plurality of terminals BL areelectrically connected to each other via the wiring THW. Moreover,solder balls SB are joined to the plurality of terminals LD,respectively. As similar to the terminals LD, each of the plurality ofsolder balls SB can be regarded as the external interface terminal ofthe semiconductor device PKG1. Note that an example shown in FIG. 3shows a case in which openings for individually exposing the pluralityof terminals LD respectively are formed in the insulating film SR2.However, a size and a shape of each opening includes various modifiedexamples. For example, a large opening for collectively exposing theplurality of adjacent terminals LD therefrom may be formed in theinsulating film SR2.

As described above, each of the insulating film SR1 and the insulatingfilm SR2 functions as a protective film for covering the conductorpattern such as a wiring pattern formed on the uppermost layer or thelowermost layer of the wiring substrate WB. For this reason, from aviewpoint of preventing a gap from being generated between the basemember BSP and the insulating films SR1 and SR2, the insulating film SR1and the insulating film SR2 are preferably comprised of a materialsofter than a material of the base member BSP. If the insulating filmSR1 (or the insulating film SR2) has flexibility at least when beingdisposed on the base member BSP, this is made tightly in contact withthe upper surface BSPt or the lower surface BSPb of the base member BSPin accordance with irregularities derived from the conductor pattern.Moreover, since the strength of the wiring substrate WB is mainlydetermined by the strength of the base member BSP, a strength as largeas the strength of the base member BSP is not required for theinsulating film SR1 and the insulating film SR2. Therefore, in thepresent first embodiment, the insulating film SR1 and the insulatingfilm SR2 each comprised of a resin containing no glass fibers are used.For this reason, the degree of flatness of each of the upper surface SR1t of the insulating film SR1 and the lower surface SR2 b of theinsulating film SR2 (particularly the degree of flatness of a part thatdo not cover the conductor pattern formed on each of the upper surfaceBSPt and the lower surface BSPb of the base member BSP) is higher thanthe degree of flatness of the surface of the resin containing glassfibers. In other words, each of the insulating film SR1 and theinsulating film SR2 comprised of the resin containing no glass fiberscan have a smaller surface roughness value (be smaller in the roughness)than a value of the resin containing the glass fibers. For this reason,the roughness of each of the upper surface SR1 t of the insulating filmSR1 and the lower surface SR2 b of the insulating film SR2 (particularlya roughness of a part that does not cover the conductor pattern formedon each of the upper surface BSPt and the lower surface BSPb of the basemember BSP) is smaller than the surface roughness of the resincontaining the glass fibers. Note that the composition of the resinforming each of the insulating film SR1 and the insulating film SR2 isnot particularly limited, and, for example, an organic resin that isgenerally commercialized as a solder resist can be used. The resinutilized as the solder resist includes, for example, a photosensitivepolymer having a carboxyl group, a cross-linking agent (such as epoxyresin), various curing initiators (photo-curing initiators orthermosetting initiators), fillers and others. Moreover, in the presentfirst embodiment, the explanation has been made about the usage of theresin containing no glass fibers as the insulating film SR1 (or theinsulating film SR2). However, the resin containing the glass fibers maybe used as the insulating film SR1 (or the insulating film SR2).However, the upper surface SR1 t of the insulating film SR1 is acomponent mounting surface (component fixing surface) on whichcomponents such as the semiconductor chip CP and the frame member FLPand others are mounted (fixed). Therefore, from the viewpoint of stablyfixing the components on the upper surface SR1 t, the upper surface SR1t of the insulating film SR1 is as preferably flat as in the case ofusing the resin containing no glass fibers even when the resincontaining the glass fibers is used as the insulating film SR1.

Moreover, on the upper surface WBt of the wiring substrate WB, thesemiconductor chip CP is mounted. The semiconductor chip CP has a frontsurface (main surface, upper surface) CPt, a rear surface (main surface,lower surface) CPb opposite to the surface CPt and a side surface CPs(see FIG. 2) located between the surface CPt and the rear surface CPb asshown in FIG. 3, and has a square external shape having a plane areathat is smaller than that of the wiring substrate WB when seen in a planview as shown in FIG. 2.

The semiconductor chip CP has a plurality of pads (electrode pads,bonding pads, chip electrodes) PD formed on the front surface CPt. In anexample shown in FIG. 2, the plurality of pads PD are arranged alongfour sides (along side surfaces CPs) forming outer edges of the frontsurface CPt. Moreover, in an example shown in FIG. 3, the semiconductorchip CP is mounted on the upper surface WBt via the bonding material DBwhile the rear surface CPb faces to the upper surface WBt of the wiringsubstrate WB. This mounting system is referred to as “face-up mountingsystem”.

The semiconductor chip CP (more specifically, the semiconductorsubstrate of the semiconductor chip CP) is comprised of, for example,silicon (Si). Moreover, an insulating film covering the base member andthe wiring of the semiconductor chip CP is formed on the front surfaceCPt, and each of the surfaces of the plurality of pads PD is exposedfrom the insulating film in the opening formed on the insulating film.Moreover, each of the plurality of pads PD is comprised of a metal suchas aluminum (Al) in the present embodiment.

In an example shown in FIG. 2 and FIG. 3, the semiconductor chip CP is aso-called image sensor chip having a light-receiving part LRP on which aplurality of image sensor elements (light-receiving elements) formed onthe front surface CPt side are arranged. The image sensor element is,for example, a solid-state image pickup element that utilizes a CMOS(Complementary Metal Oxide Semiconductor) for reading an electric signalthat is output from a photodiode (photoelectric conversion circuit). Theplurality of image sensor elements arranged in the light-receiving partLRP on the front surface CPt side of the semiconductor chip CP areelectrically connected to the plurality of pads PD formed on theperipheral edge portion of the front surface CPt.

The plurality of pads PD of the semiconductor chip CP are electricallyconnected to the plurality of terminals BL of the wiring substrate WBvia the plurality of wires (conductive members) BW each comprised of ametal material such as gold (Au) or copper (Cu). One end of each of thewires BW is joined to the pad PD of the semiconductor chip CP, and theother end thereof is joined to the terminal BL of the wiring substrateWB. In a case of a semiconductor package having a sensor chip such as animage sensor chip, it is required to set the sensor part to be visibleoften. For this reason, in the example shown in FIG. 2 and FIG. 3, thesemiconductor chip CP is mounted by the face-up mounting system suchthat the semiconductor chip CP and the wiring substrate WB areelectrically connected with each other via the wire BW.

However, as a modified example of the present embodiment, thelight-receiving part LRP constituted by the plurality of image sensorelements may be formed on the rear surface CPb side of the semiconductorchip CP. In this case, in order to bring the rear surface CPb to bevisible, the semiconductor chip CP is mounted on the wiring substrate WBwhile the surface CPt side faces to the upper surface WBt of the wiringsubstrate WB. Such a mounting system is referred to as “face-downpackaging system”. Moreover, in this case, in a thickness direction(Z-direction shown in FIG. 3) of the semiconductor device PKG1, the padsPD of the semiconductor chip CP and the plurality of terminals BL areoverlapped with each other such that they are electrically connectedwith each other via a bump electrode not shown. A method of electricallyconnecting the pads PD of the semiconductor chip CP and the terminals BLof the wiring substrate WB via the bump electrode as described above isreferred to as “flip-chip connection system”.

Moreover, as shown in FIG. 2, in a plan view seen from the upper surfaceWBt side of the wiring substrate WB, the frame member FLP is fixed(disposed) on the periphery of the semiconductor chip CP, and the covermember CVG shown in FIG. 1 is fixed on the frame member FLP. From theviewpoint of improving the reliability of the semiconductor device PKG1,it is preferable to protect the pads PD and the light-receiving part LRPof the semiconductor chip. Moreover, when the wires BW are connected tothe pads PD as described in the present embodiment, it is alsopreferable to protect the wires BW in order to suppress the wires BWfrom being deformed by an external force.

However, in the case of the semiconductor device PKG1, it is required toirradiate the light-receiving part LRP with light, and therefore, it isdifficult to adopt a generally-used resin sealing method for protectingthe wires BW and the semiconductor chip CP. Therefore, in thesemiconductor device PKG1, the periphery of the semiconductor chip CP isprotected by using the frame member FLP as shown in FIG. 2, and thesemiconductor chip CP is covered with the led member CVG as shown inFIG. 3, such that the surface CPt side of the semiconductor chip CP isprotected by the cover member CVG.

As shown in FIG. 4, the frame member FLP has a lower surface (surface,main surface) FLb that faces to the upper surface SR1 t of theinsulating film SR1 and an upper surface (surface, main surface) FLtthat is opposite to the lower surface FLb. The frame member FLP is fixedonto the wiring substrate WB via a bonding material BND1 while the uppersurface SR1 t of the insulating film SR1 and the lower surface FLb ofthe frame member FLP face to each other. Although described in detaillater, the bonding material BND1 is a so-called thermosetting resincontaining a thermosetting resin material such as an epoxy-based resinas a main component.

Moreover, the frame member FLP has an outer side surface FLs1 and aninner side surface FLs2 that are located between the upper surface FLtand the lower surface FLb in a thickness direction (Z-direction shown inFIG. 4) of the frame member FLP. When seen in a plan view, the outerside surface FLs1 is a side surface that is located closer to theperipheral edge of the wiring substrate WB than the inner side surfaceFLs2. Moreover, the inner side surface FLs2 is a surface that faces to amember such as the semiconductor chip CP (see FIG. 3). As shown in FIG.2 and FIG. 3, the semiconductor chip CP is mounted on a regionsurrounded by the frame member FLP when seen in a plan view. The framemember FLP is disposed such that the periphery of the semiconductor chipCP is continuously surrounded.

Moreover, as shown in FIG. 4, the frame member FLP contains the glassfibers as similar to the above-described base member BSP. Morespecifically, the frame member is formed by curing a so-called prepregmaterial formed by impregnating a glass fiber sheet with a resin RESthat is an epoxy-based thermosetting resin, the glass fiber sheet beingformed by shaping the glass fibers GC to have a sheet shape. Since theframe member FLP contains the glass fibers GC, the support strength ofthe cover member CVG can be improved. Although described in detaillater, the shape of the frame member FLP is formed by removing themembers (the glass fibers GC and the cured resin RES) inside the frameshape after the prepreg material has been cured. For this reason, fromeach of the outer side surface FLs1 and the inner side surface FLs2 ofthe frame member FLP, a part of the glass fibers GC is exposed. On theother hand, from the upper surface FLt and the lower surface FLb of theframe member FLP, no glass fibers GC are exposed.

Moreover, the cover member CVG has a lower surface CVGb that faces tothe upper surface WBt of the wiring substrate WB and an upper surfaceCVGt that is opposite to the lower surface CVGb. Moreover, in thethickness direction (Z-direction in FIG. 4) of the cover member CVG, thecover member CVG has a side surface CVGs located between the uppersurface CVGt and the lower surface CVGb.

As shown in FIG. 3, the cover member CVG is mounted on the upper surfaceFLt of the frame member FLP via a bonding material BND2 such that thelower surface CVGb faces to the upper surface SR1 t of the insulatingfilm SR1 and the front surface CPt of the semiconductor chip CP. Thebonding material BND2 is made tightly in contact with the upper surfaceFLt of the frame member FLP. In other words, the bonding material BND2and the upper surface FLt of the frame member FLP are tightly made incontact with each other. Moreover, although described in detail later,the bonding material BND2 is a so-called ultraviolet-ray curable resinthat contains a resin component as a main component, that is cured whenirradiated with an ultraviolet ray.

The cover member CVG is a glass plate that is transparent relative tovisible light, such that the light-receiving part LRP (see FIG. 2) ofthe semiconductor chip CP (see FIG. 2) can be visible from the uppersurface CVGt of the cover member CVG. For example, in the example shownin FIG. 3 and FIG. 4, optical characteristics of the cover member CVGare as follows. That is, the cover member CVG has an absolutereflectance of 1% or less relative to light in a wavelength range of 400nm to 700 nm. Moreover, the cover member CVG has an absolute reflectanceof 5% or less relative to light in a wavelength range of 450 nm to 650nm.

Moreover, the cover member CVG may be formed by a glass layer having aone-layer structure, or may be formed such that various opticalfunctional films for improving the optical characteristics of the covermember CVG are stacked. For example, in the cover member CVG shown inFIG. 4, a reflection preventive film AR is formed on each of the uppersurface and the lower surface of a glass layer GLL serving as a basemember. The reflection preventive film AR is a thin film having areflectance different from that of the glass layer GLL, and is comprisedof an inorganic material. The reflection preventive film AR is formedsuch that each of the upper surface and lower surface of the glass layerGLL is covered. By stacking the reflection preventive film AR having areflectance different from that of the glass film GLL, a phasedifference is caused in reflection light rays reflected by an interfaceamong the respective members. The reflection light rays are interferedsuch that they cancel with one another by this phase difference, andtherefore, the entire reflectance of the cover member CVG can bereduced.

Moreover, as a modified example of the cover member CVG, not only theabove-described reflection preventive film AR but also various opticalfunctional films may be formed. For example, an inorganic film(hereinafter, referred to as IR filter film) having characteristics ofreflecting or absorbing infrared ray may be formed on either one or bothof the upper surface CVGt and the lower surface CVGb of the cover memberCVG. Furthermore, for example, the reflection preventive film AR may beformed on either one of the upper surface CVGt and the lower surfaceCVGb of the cover member CVG, and the IR filter film may be formed onthe other one. For example, the glass layer GLL may be exposed fromeither one of the upper surface CVGt and the lower surface CVGb of thecover member CVG. Moreover, another modified example of the cover memberCVG may be a plate member (not shown) comprised of a resin material(transparent resin material) that is transparent relative to visiblelight without forming the glass layer. This case preferably providestransparency relative to the visible light as large as transparency in acase of usage of the above-described glass plate.

<Details of Bonding Portion Between Cover Member and Frame Member>

Next, a structure of a bonding portion between the frame member FLP andthe cover member CVG will be explained. As described above, in thesemiconductor device PKG1, the semiconductor chip CP is protected bysurrounding the periphery and the upper portion of the semiconductorchip by the frame member FLP and the cover member CVG. However,according to the studies by the inventor of the present application, itis found that the cover portion CVG in a bonded and fixed portion of thecover member CVG onto the frame member FLP is peeled off from the framemember FLP, depending on a state of the bonding interface between thebonding material BND2 and the frame member FLP. Hereinafter, thefindings and the means for solving the problem obtained by the studiesby the inventor of the present application will be explained.

As similar to the semiconductor device PKG1, the inventor of the presentapplication has evaluated the image sensor package in which thesemiconductor chip serving as the image sensor is mounted on the wiringsubstrate through a reflow heat resistance test. The reflow heatresistance test was performed in the following method. First, as apre-treatment, an image sensor package wrapped as similar to a productwas taken out of a wrapping material, and was left at a predeterminedenvironmental condition (temperature: 125° C., time: 24 hours orlonger). Next, the image sensor package was further left at atemperature of 30° C. under a humidity of 60% for 48 hours, 72 hours, or168 hours. Next, a heating process in an assumption of a reflow processat the time of packaging was performed to the pre-treated image sensorpackage. The heating condition or others is set by using a conditionsuch as solder to be used at the time of packaging, and a temperatureprofile to bring a temperature to, for example, about 260° C. wasperformed repeatedly a plurality of times (for example, about threetimes).

As a result of the above-described reflow heat resistance test on aplurality of image sensor packages, it has been confirmed that thebonding material for bonding the cover member and the frame member ispeeled off in some of the image sensor packages. Therefore, the inventorof the present application analyzed the peeled packages, and obtainedthe following findings. That is, it has been found that theabove-described peeling was caused in the vicinity of the bondinginterface between the bonding material and the frame member. Moreover,for the peeled package, it has been found that a large number of smallbubbles are formed on the peeled bonding interface and in the bondingmaterial.

As a result of further studies made by the inventors of the presentapplication based on the above-described findings, the above-describedpeeling is considered to be caused by the following mechanism. That is,when the glass fibers contained in the frame member absorb moisture, themoisture is vaporized in the reflow process. At this time, while a gas(water vapor) generated by the vaporization of the moisture in thevicinity of the side surface of the frame member is discharged outsideof the frame member from the side surface of the frame member, a gas(water vapor) generated by the vaporization of the moisture that hasinfiltrated into the frame member (that is at a position distant fromthe side surface) travels in a direction toward the upper surface of theframe member. At this time, the gas (water vapor) generated by thevaporization of the moisture is discharged from a portion of the uppersurface of the frame member where the glass fibers are exposed from theresin or a portion thereof where the thickness of the resin covering theglass fibers is thin. Then, the water vapor is accumulated on thebonding interface between the bonding material and the frame member, andas a result, the above-described peeling is caused at the portion wherethe water vapor is accumulated. Moreover, a large number of bubblesconfirmed by the inventors of the present application are considered tobe an evidence of the vaporization of the moisture from the uppersurface side of the frame member.

Here, with reference to FIG. 5 and FIG. 6, a relation between theroughness of the upper surface of the frame member and the infiltrationof the water vapor into the upper surface of the frame member will bedescribed. FIG. 5 is an enlarged cross-sectional view of the uppersurface of the frame member according to a study example of the presentembodiment. FIG. 6 is an enlarged cross-sectional view showing the uppersurface and the lower surface of the frame member shown in FIG. 4. Inthe case of the image sensor package studied by the inventors of thepresent embodiment as shown in FIG. 5, the roughness (surface roughness)of the upper surface FLt of the frame member FLPh is large. This is aconfiguration intended to improve the bonding strength between the framemember FLPh and the bonding material by increasing the bonding areabetween the upper surface FLt of the frame member FLPh and the bondingmaterial. However, when attention is paid to the thickness of the resinRES in the vicinity of the upper surface FLt of the frame member FLPh,in other words, to the distance from the glass fibers GC to the uppersurface FLt of the frame member FLPh, there is a portion where thethickness of the resin RES is thin in the case of the frame member FLPhshown in FIG. 5. In the example shown in FIG. 5, a large number of holesare formed on the upper surface FLt of the frame member FLPh, and eachbottom surface of the holes has a shorter distance to the glass fibersGC than those of other surfaces.

Moreover, the portion where the thickness of the resin RES is thin tendsto be easily damaged by a pressure of the gas (water vapor) generatedwhen the moisture captured inside the glass fibers GC is vaporized inthe above-described reflow process. That is, the large number of holesformed in the upper surface FLt of the frame member FLPh are consideredto be a cause that makes the water vapor infiltrate easily into thebonding interface between the frame member FLPh and the bondingmaterial.

Therefore, based on the above-described study results, the inventor ofthe present application has found a configuration in which the portionwhere the thickness of the resin RES becomes locally thin between theupper surface FLt and the glass fibers GC can be reduced by flatteningthe upper surface FLt of the frame member FLP as shown in FIG. 6. In thecase of the present embodiment, the upper surface FLt of the framemember FLP is as flat as the upper surface SR1 t of the insulating filmSR1 shown in FIG. 4, or is flatter than the upper surface SR1 t. Inother words, the flatness of the upper surface FLt of the frame memberFLP is as much as the flatness of the upper surface SR1 t of theinsulating film SR1, or is higher than that of the upper surface SR1 t.In still the other words, the roughness of the upper surface FLt of theframe member FLP is as much as or less than the roughness of the uppersurface SR1 t of the insulating film SR1.

As a value of the surface roughness, a value of a ten-point averageroughness Rz defined by the Japanese Industrial Standards (JIS B0601-1994) has been used as an evaluation index. That is, the roughnessRz is set such that a value is expressed in terms of micrometers (μm),the value being obtained by sampling only a standard length from aroughness curve in a direction of an average line of the roughnesscurve, and by determining a sum of an average value among absolutevalues of altitudes of the highest to the fifth highest peak points andan average value among absolute values of altitudes of the lowest to thefifth lowest valley points, the altitudes being measured from theaverage line of the sampled section in a direction of verticalmagnification. In the present first embodiment, note that each of thehighest peak point and the lowest valley point is specified within, forexample, a range of 50 μm square. However, the present invention is notlimited to this range.

A roughness Rz of the upper surface FLt of the frame member FLPh shownin FIG. 5 is about 7 to 8 μm. Moreover, a roughness Rz of a part of theupper surface SR1 t of the insulating film SR1 shown in FIG. 4, the partnot covering the conductor pattern formed on the upper surface BSPt ofthe base member BSP, is about 3.1 to 4.9 μm. On the other hand, theroughness Rz of the upper surface FLt of the frame member FLP shown inFIG. 6 is set to about 2.7 to 3.3 μm, and more preferably, about 1.0 to1.5 μm.

If the upper surface FLt of the frame member FLP is flat as shown inFIG. 6, there are few portions where the distance between the uppersurface FLt and the glass fibers GC is locally shortened. In the reflowprocess, this case can suppress concentration of the pressure that iscaused by the local application of the pressure of the moisture (watervapor) vaporized from the glass fibers CG onto the resin RES forming theframe member FLP. That is, the resin RES is difficult to be damagedbecause of the flat upper surface FLt of the frame member FLP, andtherefore, the water vapor is difficult to reach the upper surface FLtof the frame member FLP. As a result, it is possible to suppress thewater vapor from infiltrating into the bonding interface between theframe member FLP and the bonding material BND2 shown in FIG. 4, andtherefore, the peeling off between the frame member FLP and the bondingmaterial BND2 can be suppressed. Moreover, when the upper surface FLt isflattened by polishing the upper surface FLt as shown in FIG. 5, thedistance between the glass fibers GC and the upper surface FLt becomesshort on average. However, in the present embodiment, as shown in FIG.10 to be described later, the upper surface FLt of the frame member FLPis flattened as shown in FIG. 6 by removing a metal film MF1 after themetal film MF1 whose press-bonding surface is flattened has beenpress-bonded onto a resin member PPB. For this reason, the distancebetween the glass fibers GC and the upper surface FLt becomes large onaverage. For example, in an example shown in FIG. 6, the shortestdistance from an upper end of the glass fibers GC to the upper surfaceFLt is about as large as a diameter of the glass fiber GC, and is atleast larger than a radius of the glass fiber GC. This case can furthersuppress the damage of the resin RES than in the case in which the uppersurface FLt is flattened by the polishing as shown in FIG. 5.

According to the studies by the inventor of the present application, thehigher the flatness of the upper surface FLt is, the easier thesuppression of the above-described peeling is. For example, when theroughness Rz of the upper surface FLt was about 1.0 to 1.5 μm asdescribed above, the above-described peeling was hardly confirmed in theevaluation based on the reflow heat resistant test. The roughness Rz ofthe rear surface CPb of the semiconductor chip CP shown in FIG. 3 wasabout 1.5 μm. Therefore, when the roughness Rz of the upper surface FLt(see FIG. 4) was about 1.0 to 1.5 μm, a value of the roughness Rz of theupper surface FLt is equal to or smaller than a value of the roughnessof the rear surface CPb of the semiconductor chip CP. In other words,the roughness of the upper surface FLt of the frame member FLP is equalto or less than the roughness of the rear surface CPb of thesemiconductor chip CP.

Moreover, as shown in FIG. 6, on the outer side surface FLs1 of theframe member FLP, a part of the glass fibers GC is exposed from theresin RES. In this case, the frame member FLP is easier to absorbmoisture than that in the case in which no glass fibers GC are exposed.However, according to the present embodiment, the water vapor issuppressed from reaching the upper surface FLt by flattening the uppersurface FLt of the frame member FLP, and therefore, the peeling of thebonding material BND2 can be suppressed.

Note that the explanation has been made about the fact that no glassfibers are contained in the insulating film SR1 and the insulating filmSR2 of the semiconductor device PKG1. However, as shown in FIG. 4, aplurality of filler particles SLF are contained therein. Moreover, asshown in FIG. 4, not only the glass fibers GC and the resin RES but alsothe plurality of filler particles SLF are contained in the frame memberFLP. However, as a modified example, no filler particles SLF arecontained in the insulating film SR1, the insulating film SR2 and theframe member FLP in some cases.

The filler particles SLF are particles for use in adjusting thecharacteristics (for example, characteristics such as a linear expansioncoefficient) of the insulating film SR1 and the insulating film SR2 (orthe frame member FLP), which are comprised of an inorganic material suchas, for example, silica (substance comprised of silicon dioxide) orothers. When the filler particles SLF are contained in the insulatingfilm SR1, the filler particles SLF absorb moisture. When the moistureabsorbed by the filler particles SLF is vaporized by heating, the watervapor moves to an upper part of the insulating film SR1, and isdischarged from the upper surface SR1 t of the insulating film SR1.However, when it is studied whether the peeling is caused by theinfiltration of the water vapor into the bonding interface between thebonding material BND1 and the insulating film SR, the amount of themoisture absorbed by the filler particles SLF (hereinafter, referred toas “moisture absorption amount”) is extremely smaller than the moistureabsorption amount of the glass fibers GC, and is substantiallyvanishingly small. For this reason, even if a large amount of fillerparticles SLF are contained in the insulating film SR1, it is consideredthat the peeling due to the moisture absorption of the filler particlesSLF is not caused.

<Method of Manufacturing Semiconductor Device>

Next, a method of manufacturing the semiconductor device PKG1 shown inFIG. 1 to FIG. 4 will be explained. FIG. 7 is an explanatory viewshowing an assembly flow of the semiconductor device shown in FIG. 1 toFIG. 4. In the present embodiment, explanation will be made byexemplifying a mode in which a wiring substrate on which a frame memberis mounted is purchased and a semiconductor chip or others is mountedand assembled on the wiring substrate. For this reason, as shown in FIG.7, the frame member mounting process or others is included in a wiringsubstrate preparation process. However, a part or the entire of therespective processes included in the wiring substrate preparationprocess may be collectively performed at one factory. For example, eachof the frame member assembly process, the frame member mounting process,the heating treatment process and the dicing process shown in FIG. 7 maybe not included in the wiring substrate preparation process, and each ofthe processes may be a different process from the wiring substratepreparation process.

<Wiring Substrate Preparation Process>

As shown in FIG. 8 and FIG. 9, in the wiring substrate preparationprocess shown in FIG. 7, the wiring substrate WB having the frame memberFLP mounted on the upper surface WBt is prepared. FIG. 8 is a plan viewof the wiring substrate prepared in the wiring substrate preparationprocess shown in FIG. 7. FIG. 9 is a cross-sectional view taken along aline A-A of FIG. 8.

As shown in FIG. 9, the wiring substrate WB to be prepared in thepresent process has a base member BSP, a terminal BL formed on the uppersurface BSPt of the base member BSP, an insulating film SR1 formed onthe upper surface BSPt such that the terminal BL is exposed, and aninsulating film SR2 formed on the lower surface BSPb such that theterminal LD is exposed. On the wiring substrate WB to be prepared in thepresent process, the semiconductor chip CP shown in FIG. 3 is notmounted. Moreover, to the plurality of terminals BL, wires BW shown inFIG. 3 are not connected. Furthermore, a solder ball SB shown in FIG. 3is not connected to each of the plurality of terminals LD. A structureof the wiring substrate WB to be prepared in the present process is thesame as a structure of the wiring substrate WB shown in FIG. 1 to FIG. 3except for the above-described differences. Therefore, repetitiveexplanations will be omitted.

Moreover, onto the upper surface SR1 t of the insulating film SR1, theframe member FLP is bonded and fixed via the bonding material BND1. Asexplained with reference to FIG. 4, the frame member FLP is a membercomprised of the glass fibers GC and the resin RES with which the glassfibers GC are impregnated, and is bonded and fixed onto the wiringsubstrate WB while the lower surface FLb faces to the upper surface SR1t of the insulating film SR1 of the wiring substrate WB.

The bonding material BND1 is a material that is formed by curing anadhesive containing a thermosetting resin as its main component. In thepresent embodiment, the bonding material BND1 is a bonding tape obtainedby forming an adhesive layer containing a thermosetting resin as a maincomponent on both surfaces of a resin film serving as a base member.When the bonding tape is used, the bonding material BND1 (see FIG. 9)can be previously adhered on the lower surface FLb (see FIG. 9) of theframe member FLP (see FIG. 9) in the frame member assembly process shownin FIG. 7. Moreover, when the bonding tape is used, the amount of thebonding material BND1 that spreads on the periphery of the frame memberFLP can be smaller than that of a paste bonding material. For thisreason, this bonding material is effective when the distance from theregion on which the frame member FLP is mounted to the terminal BL isshort. As a modified example of the present embodiment, a paste bondingmaterial which contains a thermosetting resin as a main component andwhich is in a paste state before being cured may be used as the bondingmaterial BND1. In the case of the paste bonding material, a part of thebonding material also adheres to the inner side surface FLs2 (see FIG.4) of the frame member FLP. Thus, an area of the bonding between thebonding material BND1 and the frame member FLP increases, and therefore,the bonding strength of the frame member FLP can be improved.

In the frame member mounting process, the frame member FLP having thebonding material BND1 adhered on the lower surface FLb is arranged onthe wiring substrate WB (see FIG. 9), and the bonding material BND1 andthe upper surface SR1 t of the insulating film SR1 are bonded to eachother. Then, a heating treatment (cure baking) for curing thethermosetting resin component of the bonding material BND1 shown in FIG.9 is performed (heating treatment process). When the thermosetting resincomponent contained in the bonding material BND1 is cured, the framemember FLP is bonded and fixed onto the wiring substrate WB.

When the glass fibers GC (see FIG. 6) contained in the frame member FLPhave absorbed the moisture prior to the heating treatment process, themoisture is vaporized during the heating treatment process in somecases. At this time, when the upper surface FLt is rough as similar tothe frame member FLPh explained with reference to FIG. 5, a part of theresin RES is damaged by the pressure of the water vapor to form apassage that communicates from the upper surface FLt to the glass fibersGC in some cases. When the passage that communicates with the uppersurface FLt is formed in the present process, the passage becomes acause of movement of the water vapor to the upper surface FLt every timethe moisture absorbed by the glass fibers GC is vaporized.

Therefore, when the upper surface FLt that is rough as similar to theframe member FLPh shown in FIG. 5 is used, it is required to use amethod of, for example, heating while peripherally releasing thepressure of the water vapor by making a temperature-rising rate slow inorder to suppress the damage in a part of the resin RES.

On the other hand, in the case of the frame member FLP of the presentembodiment shown in FIG. 6, the upper surface FLt is flattened such thatthe value of the roughness Rz of the upper surface FLt is about equal toor smaller than the value of the roughness Rz of the upper surface SR1 t(see FIG. 9) of the insulating film SR1 (see FIG. 9). Therefore, even ifthe moisture is vaporized from the glass fibers GC in the heatingtreatment process, the resin RES is difficult to be damaged. Thus, sucha particular process as to make the temperature-rising rate slow asdescribed above is unnecessary. As a result, the heating treatmentprocess can be efficiently performed.

Incidentally, for example, the frame member FLP as shown in FIG. 8 andFIG. 9 is assembled as follows. FIG. 10 and FIG. 11 are explanatoryviews each showing one example of a detailed flow of the frame memberassembly process shown in FIG. 7. In FIG. 10 and FIG. 11, explanatorydiagrams for schematically showing the outline of each of processes aremade to be close to each of the processes included in the frame memberassembly process.

In the frame member assembly process, first, a glass fiber sheet GCSobtained by forming glass fibers into a sheet shape is prepared (glassfiber sheet preparation process). Then, the glass fiber sheet GCS isimmersed in the resin RES such that the glass fiber sheet GCS isimpregnated with the resin RES (resin impregnating process).

Then, a part of the thermosetting resin component contained in the resinRES is cured, such that a resin member (prepreg member) PPB comprised ofthe glass fiber sheet GCS and the half-cured resin RES is formed. Notethat the above-described half-cured state represents a state in which apart of the thermosetting resin component is cured but not completelycured, and this state is not limited to a state in which 50% of thethermosetting resin component is cured.

Then, the half-cured resin member PPB is sandwiched by a metal film MF1and a metal film MF2, and the metal film MF1 and the metal film MF2 arepress-bonded onto the resin member PPB (metal film press-bondingprocess). Each of the metal film MF1 and the metal film MF2 is, forexample, a copper foil. At this time, by adjusting the roughness Rz ofthe press-bonding surface of the metal film MF1, the roughness Rz of theupper surface FLt of the frame member FLP shown in FIG. 6 can becontrolled. For example, when the roughness Rz of the press-bondingsurface of the metal film MF1 is large, a frame member having the largeroughness Rz of the upper surface FLt as similar to the frame memberFLPh shown in FIG. 5 is obtained. When the metal film MF1 whosepress-bonding surface has been subjected to a surface rougheningtreatment is used, if the metal film MF1 is press-bonded onto the resinmember PPB, a protrusion protruding from a surface of the metal film MF1digs into the resin member PPB. As a result, the portion where thedistance from the upper surface FLt of the frame member FLPh to theglass fiber GC is short, that is, where the resin RES is thin, isformed. On the other hand, when the press-bonding surface of the metalfilm MF1 is flattened, the protrusion amount of the protrusion from thesurface of the metal film MF1 is small. Therefore, even if such a metalfilm MF1 is press-bonded to the resin member PPB, a frame member FLPwhose roughness Rz of the upper surface FLt is not high as shown in FIG.6, that is, the frame member FLP whose distance from the upper surfaceFLt to the glass fibers GC is long, in other words, the frame member FLPwhere the resin RES is thick, can be obtained.

Similarly, by adjusting the roughness Rz of the press-bonding surface ofthe metal film MF2, the roughness Rz of the lower surface FLb of theframe member FLP shown in FIG. 4 can be controlled. In the presentembodiment, the roughness Rz of the press-bonding surface of the metalfilm MF1 and the roughness Rz of the press-bonding surface of the metalfilm MF2 are almost equal to each other. For this reason, the roughnessRz of the upper surface FLt and the roughness Rz of the lower surfaceFLb of the frame member FLP shown in FIG. 4 are almost equal to eachother. Therefore, the roughness Rz of the lower surface FLb of the framemember FLP shown in FIG. 4 is not so higher than the roughness Rz of theupper surface SR1 t of the insulating film SR1. Moreover, the roughnessRz of the lower surface FLb of the frame member FLP is not so higherthan the roughness Rz of the lower surface SR2 b of the insulating filmSR2. Particularly, the roughness Rz of the lower surface FLb of theframe member FLP is preferably not so higher than the roughness Rz ofthe rear surface CPb of the semiconductor chip CP shown in FIG. 3.

Thereafter, a heating treatment (cure baking) is performed on the resinmember PPB while the metal film MF1 and the metal film MF2 arepress-bonded thereto, such that the thermosetting resin componentcontained in the resin member PPB is cured (resin curing process). Inthe present process, it is preferable to make the temperature-risingrate slow in order to suppress damage on a part of the resin RES (seeFIG. 6) before being cured due to the gas (vaporized moisture, watervapor) generated from the glass fibers.

Thereafter, each of the metal film MF1 and the metal film MF2 is removedsuch that the upper surface FLt and the lower surface FLb of the framemember FLP shown in FIG. 4 are exposed (metal film removing process).The metal film MF1 and the metal film MF2 can be removed by, forexample, etching. When the metal film MF1 is selectively removed by theetching, the upper surface FLt having the roughness Rz explained withreference to FIG. 6 is exposed. Similarly, when the metal film MF2 isselectively removed by the etching, the lower surface FLb having theroughness Rz that is almost equal to that of the upper surface FLt isexposed.

Thereafter, the through hole TH is formed in the resin member PPB fromwhich the metal films MF1 and MF2 have been removed, and is molded intoa frame shape (hole forming process). In an example shown in FIG. 11, anexample mode in which a plurality of frame members are collectivelymanufactured is shown. Therefore, the number of (twelve in FIG. 11)through holes TH as shown in FIG. 11 corresponds to the number of framemembers to be collectively assembled.

Moreover, when a bonding tape is utilized as the bonding material BND1(see FIG. 9) as described above, the bonding material BND1 is adhered(bonding material adhering process) after the hole forming process. Whena through hole is also formed in the bonding tape together with theresin member PPB in the hole forming process, the bonding materialadhering process may be performed after the metal film removing processand before the hole forming process. Moreover, when the paste bondingmaterial is used as the bonding material BND1, the bonding materialadhering process can be omitted. In this case, before the frame membermounting process shown in FIG. 7, a bonding material applying process(illustration is omitted) for applying the paste bonding material isperformed on at least either the wiring substrate or the frame member.

When the plurality of frame members FLP are collectively assembled asshown in FIG. 11, a frame member FLM obtained by collectively assemblingthe plurality of frame members as shown in FIG. 12 is mounted on awiring substrate WBM from which multiple pieces are chipped in the framemember mounting process shown in FIG. 7. FIG. 12 is a plan view showinga state in which the frame members are mounted on the wiring substratein the frame member mounting process shown in FIG. 7. The wiringsubstrate WBM from which multiple pieces are chipped is a wiringsubstrate on which portions corresponding to a plurality of wiringsubstrates WB (see FIG. 9) (device regions DVP shown in FIG. 12) areintegrally formed. When the wiring substrate WBM from which multiplepieces are chipped is utilized, the manufacturing efficiency is improvedsince the plurality of wiring substrates WB can be collectivelymanufactured.

Moreover, in an example shown in FIG. 7, after the heating treatmentprocess, the wiring substrate WBM and the frame member FLM shown in FIG.12 are cut along extending directions of cutting regions (cutting lines,dicing lines) DCP such that they are divided for each wiring substrateWB as shown in FIG. 8 and FIG. 9 (individualization process). As thecutting method, for example, a cutting process using a rotary bladecalled a “dicing blade” or others can be used. In the example shown inFIG. 7, note that the individualization process is included in thewiring substrate preparation process. However, the individualizationprocess may be performed after the solder ball mounting process. In thiscase, in the state of the individualization wiring substrate WBM (seeFIG. 12), each process from the wiring substrate preparation process tothe solder ball mounting process shown in FIG. 7 is performed.

<Die Bonding>

Next, in a die bonding process shown in FIG. 7, a semiconductor chip CPis mounted on the upper surface WBt of the wiring substrate WB as shownin FIG. 13. FIG. 13 is a cross-sectional view showing a state in whichthe semiconductor chip is mounted on the wiring substrate shown in FIG.9.

In the present embodiment, the semiconductor chip CP is mounted (fixed)via the bonding material (die bonding material) DB on the upper surfaceSR1 t of the insulating film SR1 of the wiring substrate WB such thatthe rear surface CPb faces to the upper surface SR1 t of the insulatingfilm SR1 of the wiring substrate WB. Moreover, the semiconductor chip CPis mounted on the upper surface SR1 t in a region (chip mounting region)surrounded by the frame member FLP. Since the structure of thesemiconductor chip CP has been already explained, the overlappedexplanations will be omitted.

As similar to the bonding material BND1, the bonding material DB is abonding material containing a thermosetting resin as its main component.In an example shown in FIG. 13, the bonding material DB is a bondingtape obtained by forming an adhesive layer containing a thermosettingresin as a main component on both surfaces of a resin film forming abase member. Moreover, as a modified example, a paste bonding materialcontaining a thermosetting resin as a main component may be used as thebonding material DB. When the bonding tape is used, the mounting isenabled while the bonding material DB is previously adhered to the rearsurface CPb. Moreover, when the bonding tape is used, the amount of thebonding material DB that spreads on the periphery of the semiconductorchip CP can be smaller than that of the paste bonding material. For thisreason, this material is effective when the distance from the chipmounting region to the terminal BL is short. On the other hand, in thecase of the paste bonding material, a part of the bonding material alsoadheres on a side surface of the semiconductor chip CP. Thus, a bondingarea between the bonding material DB and the semiconductor chip CPincreases, and therefore, a bonding strength of the semiconductor chipCP can be improved.

In the present process, a heating process (cure baking) is performedafter the semiconductor chip CP is adhered to the insulating film SR1via the bonding material DB, such that the bonding material DB is cured.Thus, the semiconductor chip CP is bonded and fixed onto the wiringsubstrate WB.

Moreover, in the present process, it is preferable to prevent formationof a gap between the bonding material DB and the insulating film SR1.For this reason, the upper surface SR1 t of the insulating film SR1 ispreferably prepared as a flat surface. As described above, the roughnessRz of the upper surface SR1 t of the insulating film SR1 is set to about3.1 to 4.9 μm. If the roughness value is such a roughness value, theformation of the gap between the bonding material DB and the insulatingfilm SR1 in the die bonding process can be prevented.

<Wire Bonding>

Next, in a wire bonding process shown in FIG. 7, the pad PD of thesemiconductor chip CP and the terminal BL of the wiring substrate WB areelectrically connected to each other via the wire BW as shown in FIG.14. FIG. 14 is a cross-sectional view showing a state in which wires areconnected to the semiconductor chip and the wiring substrate shown inFIG. 13. In the present embodiment, the plurality of pads PD and theplurality of terminals BL are electrically connected to each other.

In the present process, a wire loop is formed, for example, after oneend of the wire BW is connected to the pad PD of the semiconductor chipCP. Thereafter, the wire BW is connected to the terminal BL, and then,the wire is cut, such that the wire BW as shown in FIG. 14 is obtained.

<Bonding Material Applying Process>

Next, in a bonding material applying process shown in FIG. 7, a bondingmaterial BND2 is disposed (applied) onto the upper surface FLt of theframe member FLP as shown in FIG. 15. FIG. 15 is a cross-sectional viewshowing a state in which the bonding material is applied onto the framemember shown in FIG. 14.

As described above, the bonding material BND2 is a bonding materialcontaining an ultraviolet-ray curable resin as a main component that iscured by being irradiated with an ultraviolet ray. Moreover, in thepresent embodiment, the bonding material BND2 is in a paste state beforebeing cured. For this reason, in the present embodiment, the bondingmaterial BND2 can be applied onto the upper surface FLt of the framemember FLP as shown in FIG. 15.

As a modified example of the present embodiment, note that thethermosetting resin can be contained as a main component of the bondingmaterial BND2. However, in the heating treatment (cure baking) forcuring the thermosetting resin, it is required to leave the materialunder a predetermined environmental condition (temperature: 150° C.,time: two hours or longer). For this reason, when the heating process isperformed while the semiconductor chip CP is tightly sealed as shown inFIG. 3, a heat load on the semiconductor chip CP becomes large. On theother hand, in the case of the ultraviolet-ray curable resin, thebonding material BND2 can be cured when being irradiated withultraviolet ray, and therefore, the load on the semiconductor chip CPbecomes small. Note that the above-described environmental conditionincludes various conditions depending on a material to be used.

<Cover Member Mounting>

Next, in the cover member mounting process shown in FIG. 7, a covermember CVG is mounted (fixed) on the upper surface FLt of the framemember FLP via the bonding material BND2 as shown in FIG. 16. FIG. 16 isa cross-sectional view showing a state in which the cover member ismounted on the frame member shown in FIG. 15 and is irradiated with anultraviolet ray. In FIG. 16, the ultraviolet ray UVR is schematicallyshown.

In the present process, the lower surface CVGb side of the cover memberCVG is pressed onto the bonding material BND2 such that the lowersurface CVGb of the cover member CVG faces to the upper surface SR1 t ofthe insulating film SR1 of the wiring substrate WB and the front surfaceCPt of the semiconductor chip CP. Thus, the paste bonding material BND2is deformed and spreads along the shape of the cover member CVG.

In the present embodiment, a plane size of the cover member CVG becomessmaller than a plane size of the wiring substrate WB and a plane size ofthe frame member. For this reason, each area of the upper surface CVGtand the lower surface CVGb of the cover member CVG is smaller than anarea of the upper surface WBt of the wiring substrate WB (area of theupper surface SR1 t of the insulating film SR1). Moreover, a total valueof the lengths of sides forming each outer edge of the upper surfaceCVGt and the lower surface CVGb of the cover member CVG is shorter thana total value of the lengths of the sides of the upper end of the outerside surface FLs1 of the frame member FLP.

In other words, the cover member CVG has a side surface CVGs locatedbetween the upper surface CVGt and the lower surface CVGb in itsthickness direction (Z-direction), and the side surface CVGs is locatedbetween the outer side surface FLs1 and the inner side surface FLs2 whenseen in a cross-sectional view in the thickness direction of the covermember CVG. More specifically, all the side surfaces CVGs of the covermember CVG are located between the outer side surface FLs1 and the innerside surface FLs2 when seen in a plan view.

When the plane size of the cover member CVG is smaller than the planesize of the frame member FLP as described above, even if the mountingposition of the cover member CVG slightly shifts in the present process,the cover member CVG can be suppressed from being mounted such that itprotrudes outward from the frame member FLP. Moreover, when the planesize of the cover member CVG is smaller than the plane size of the framemember FLP, the bonding material BND2 adheres to apart of the sidesurfaces CVGs of the cover member CVG as shown in FIG. 16. Thus, thebonding strength between the frame member FLP and the cover member CVGcan be improved by the bonding material BND2.

<Ultraviolet-Ray Irradiation>

Next, in an ultraviolet-ray irradiation process shown in FIG. 7, thebonding material BND2 is irradiated with an ultraviolet ray UVR as shownin FIG. 16 to cure the bonding material BND2. The cover member CVG iscomprised of a visible light transmissive material as described above.Therefore, in the present process, when, for example, an ultraviolet rayUVR is irradiated from the cover member CVG side as shown in FIG. 16,the frame member FLP can be irradiated with the ultraviolet ray via thecover member CVG.

Here, according to the study results made by the inventor of the presentapplication, it has been found that the moisture is vaporized from theglass fibers GC shown in FIG. 6 in this ultraviolet-ray irradiationprocess. When the moisture is vaporized by the heating treatment, avaporization speed can be controlled by making the temperature-risingrate slow. Therefore, for example, even when the frame member FLPh shownin FIG. 5 is utilized, the damage on the resin RES can be suppressed.However, when the moisture is vaporized from the glass fibers GC by theultraviolet ray, it is difficult to control the vaporization amount evenby controlling the irradiation amount of the ultraviolet ray. Therefore,when the frame member FLPh shown in FIG. 5 contains the moisture, theresin RES tends to be damaged by the ultraviolet-ray irradiation.

On the other hand, in the case of the frame member FLP in the presentembodiment shown in FIG. 6, the upper surface FLt is flattened such thatthe value of the roughness Rz thereof is equal to or smaller than thevalue of the roughness Rz of the upper surface SR1 t (see FIG. 9) of theinsulating film SR1 (see FIG. 9), that is, the distance from the uppersurface FLt of the frame member FLP to the glass fibers GC becomeslonger than that of the frame member FLPh shown in FIG. 5. Therefore, inthe ultraviolet-ray irradiation process, the damage on the resin RES canbe suppressed even when the moisture contained in the glass fibers GC isvaporized such that the gas pressure increases. For this reason, in theultraviolet-ray irradiation process, the infiltration of bubbles(bubbles caused by the water vapor) that becomes a cause of the peelingon the bonding interface between the bonding material BND2 and the framemember FLP can be suppressed.

When the bonding material BND2 is cured in the present process, thecover member CVG is bonded and fixed onto the frame member FLP via thebonding material BND2. Moreover, a space which is surrounded by thewiring substrate WB, the frame member FLP and the cover member CVG andon which the semiconductor chip CP is mounted is tightly sealed.

<Solder Ball Mounting>

Next, in a solder ball mounting process shown in FIG. 7, a solder ballSB is joined to the terminal LD as shown in FIG. 17. FIG. 17 is across-sectional view showing a state in which the solder ball is joinedto the terminal shown in FIG. 16.

As shown in FIG. 17, the present process is executed while the wiringsubstrate WB is turned upside down. That is, the solder ball mountingprocess is executed while the insulating film SR2 from which theplurality of terminals are exposed is at a position lower than theinsulating film SR1. In the present process, as shown in FIG. 17, whilethe wiring substrate WB is turned upside down, a solder paste or a fluxpaste not shown is applied onto the exposed surfaces of the plurality ofterminals LD. Note that the solder paste is a paste-state materialcontaining a flux component for activating a surface of a soldermaterial in addition to a solder component. Moreover, the flux paste isa paste-state material containing no solder component.

Next, the ball-shaped solder material, that is, the solder ball SB isdisposed on the terminal LD. The solder balls are disposed on theplurality of terminals LD, respectively. Next, the solder balls SB areheated (reflowed) such that the solder component is fused such that thesolder balls SB are joined to the terminals LD. At this time, the fluxcomponent contained in the solder paste or the flux paste activates thesurfaces of the solder balls SB and the terminals LD to be brought in aneasily joining state. Next, after the solder balls SB are cooled, awashing process for removing residues of the flux component or others isperformed. Thus, the semiconductor device PKG1 shown in FIG. 3 can beobtained.

In the present process, the heating treatment (reflow) is performed inthe upside down turning state. In this case, when the moisture containedin the frame member FLP is vaporized, the gas (water vapor) generatedfrom the vaporized moisture goes upward, and goes toward the bondinginterface between the bonding material BND1 and the frame member FLP(interface between the lower surface FLb and the bonding material BND1shown in FIG. 4). For this reason, from the viewpoint of suppressing thedamage on the resin RES between the lower surface FLb and the glassfibers GC shown in FIG. 4, the flattened lower surface FLb that isalmost as flat as the upper surface FLt is also preferable.

As already explained in the above-described section of the wiringsubstrate preparation process, the roughness Rz of the upper surface FLtand the roughness Rz of the lower surface FLb of the frame member FLPshown in FIG. 4 are substantially equal to each other. Therefore, theroughness Rz of the lower surface FLb of the frame member FLP shown inFIG. 4 is less than the roughness Rz of the upper surface SR1 t of theinsulating film SR1. Moreover, the roughness Rz of the lower surface FLbof the frame member FLP is less than the roughness Rz of the lowersurface SR2 b of the insulating film SR2. Most preferably, the roughnessRz of the lower surface FLb of the frame member FLP is less than theroughness Rz of the rear surface CPb of the semiconductor chip CP shownin FIG. 3. Therefore, in the solder ball mounting process, the damage onthe resin RES can be suppressed. Thus, the peeling of the bondinginterface between the frame member FLP and the bonding material BND1caused by the damage on the resin RES can be suppressed.

However, as described above, the damage on the resin caused by theheating treatment can be suppressed by making the temperature-risingtime slow. For example, in the solder ball mounting process, when theprocess temperature is made to rise to the fusing temperature of thesolder component after performing a drying process of slowly vaporizingthe moisture contained in the frame member FLP at a temperature lowerthan a fusing temperature of the solder component, the damage on theresin RES can be suppressed. Therefore, as a modified example, theroughness Rz of the lower surface FLb may be larger than the roughnessof the upper surface FLt as similar to that of a frame member FLP2 shownin FIG. 18. In other words, it is required to preferentially flatten theupper surface FLt of the frame member FLP2 rather than the lower surfaceFLb. For this reason, in the frame member FLP2, the roughness Rz of theupper surface FLt is less than the roughness of the lower surface FLb.FIG. 18 is a cross-sectional view showing a modified example of theframe member shown in FIG. 6.

<Inspection>

Next, in an inspection process shown in FIG. 7, necessary tests such asan appearance test and an electrical test are executed on thesemiconductor device PKG1. A semiconductor device that has been passedthe tests as an inspections result can be shipped as a product.

Second Embodiment

Next, as a second embodiment, a mode in which another member isinterposed between the frame member FLP and the bonding material BND2will be explained. FIG. 19, which shows a modified example of FIG. 4, isan enlarged cross-sectional view showing the periphery of the framemember included in the semiconductor device of the present embodiment.FIG. 20 is an enlarged cross-sectional view showing an upper surface anda lower surface of the frame member shown in FIG. 19.

The semiconductor device PKG2 shown in FIG. 19 is different from thesemiconductor device PKG1 shown in FIG. 4 in that a metal film (member)MF1 covering the upper surface FLt is interposed between the uppersurface FLt of the frame member FLP and the bonding material BND2.Moreover, the semiconductor device PKG2 shown in FIG. 19 is differentfrom the semiconductor device PKG1 shown in FIG. 4 in that a metal film(member) MF2 covering the lower surface FLb is interposed between thelower surface FLb of the frame member FLP and the bonding material BND1.

Each of the metal film MF1 and the metal film MF2 is a metal film thatis press-bonded onto the resin member PPB in the metal filmpress-bonding process that has been explained in the first embodiment byusing FIG. 10. Each of the metal film MF1 and the metal film MF2 is, forexample, a copper foil, and contains copper as a main component. Thesemiconductor device PKG2 shown in FIG. 19 can be obtained byeliminating the metal film removing process shown in FIG. 10.

As shown in FIG. 20, the metal film MF1 has a lower surface (surface,main surface) MFb1 that faces to the upper surface FLt of the framemember FLP and an upper surface (surface, main surface) MFt1 that isopposite to the lower surface MFb1. Moreover, in the thickness directionof the metal film MF1 (Z-direction), the metal film MF1 has an outerside surface (surface, side surface) MFs1 and an inner side surface(surface, side surface) MFs2 that are positioned between the uppersurface MFt1 and the lower surface MFb1 The metal film MF1 has a planeframe shape as similar to the frame member FLP, an outer side surface ofthe frame shape is the outer side surface MFs1, and a side surfaceopposite to the outer side surface MFs1 is the inner side surface MFs2.

Similarly, the metal film MF2 has an upper surface (surface, mainsurface) MFt2 that faces to the lower surface FLb of the frame memberFLP and a lower surface (surface, main surface) MFb2 that is opposite tothe upper surface MFt2. Moreover, in the thickness direction of themetal film MF2 (Z-direction), the metal film MF2 has an outer sidesurface (surface, side surface) MFs3 and an inner side surface (surface,side surface) MFs4 that are positioned between the upper surface MFt2and the lower surface MFb2. The metal film MF2 has a plane frame shapeas similar to the frame member FLP, an outer side surface of the frameshape is the outer side surface MFs3, and a side surface opposite to theouter side surface MFs3 is the inner side surface MFs4.

In the example shown in FIG. 19 and FIG. 20, the metal film MF1 coversthe entire upper surface FLt of the frame member FLP. For this reason,the bonding material BND2 is not made in contact with the upper surfaceFLt of the frame member FLP. Moreover, each of the outer side surfaceMFs1 and the inner side surface MFs2 of the metal film MF1 is exposedfrom the bonding material BND2. Similarly, the metal film MF2 covers theentire lower surface FLb of the frame member FLP. For this reason, thebonding material BND1 is not made in contact with the lower surface Fbof the frame member FLP. Moreover, each of the outer side surface MFs3and the inner side surface MFs4 of the metal film MF2 is exposed fromthe bonding material BND1.

As explained with reference to FIG. 10, the metal film MF1 and the metalfilm MF2 are press-bonded while the thermosetting resin componentcontained in the resin member PPB is half-cured. For this reason, thebonding strength between the metal films MF1, MF2 and the frame memberFLP shown in FIG. 20 can be ensured to be equal to or larger than thebonding strength between the upper surface FLt of the frame member FLPand the bonding material BND1 shown in FIG. 4.

Moreover, even if the moisture contained in the glass fibers GC isvaporized, the gas generated by the vaporization of the moisture doesnot pass via the metal film MF1 and the metal film MF2. Therefore, nobubbles infiltrate into the bonding interface between the metal film MF1and the bonding material BND2 and the bonding interface between themetal film MF2 and the bonding material BND1, and the peeling of thebonding materials BND1 and BND2 caused by the vaporization of themoisture can be suppressed.

Moreover, as explained in the above-described first embodiment, theupper surface FLt of the frame member FLP is flattened to be almost asflat as the upper surface SR1 t of the insulating film SR1 or flatterthan the upper surface SR1 t shown in FIG. 4. In other words, theflatness of the upper surface FLt of the frame member FLP is equal tothe flatness of the upper surface SR1 t of the insulating film SR1 orlarger than the flatness of the upper surface SR1 t. In still otherwords, the roughness of the upper surface FLt of the frame member FLP isequal to less than the roughness of the upper surface SR1 t of theinsulating film SR1. Furthermore, most preferably, the roughness Rz ofthe upper surface FLt of the frame member FLP is equal to or smallerthan the roughness Rz of the rear surface CPb of the semiconductor chipCP shown in FIG. 3. Thus, even if the moisture contained in the glassfibers GC is vaporized, the damage on the resin RES can be suppressed,and therefore, the filtration of the gas between the metal film MF1 andthe upper surface FLt of the frame member FLP can be suppressed. Thus,the peeling between the metal film MF1 and the frame member FLP can besuppressed.

Moreover, although the overlapping explanations will be omitted, becauseof same reason, the peeling of the metal film MF2 can be suppressed byreducing the roughness Rz of (in other words, by flattening) the lowersurface FLb of the frame member FLP. The degree of the roughness Rz ofthe lower surface FLb of the frame member FLP is as explained in thefirst embodiment.

Furthermore, as described above, no water vapor infiltrates into thebonding interface between the metal film MF1 and the bonding materialBND2 and the bonding interface between the metal film MF2 and thebonding material BND1, and therefore, the roughness Rz of each of theupper surface MFt1 of the metal film MF1 and the lower surface MFb2 ofthe metal film MF2 can be set to an arbitrary value. In other words, theinfluence on the peeling of the bonding materials BND2 and BND1 from theupper surface MFt1 of the metal film MF1 and the lower surface MFb2 ofthe metal film MF2 is not different between the case with the flatteningprocess and the case without the flattening process. Meanwhile, asexplained in the first embodiment, the roughness Rz of the upper surfaceFLt of the frame member FLP can be reduced by reducing the roughness Rzof the lower surface MFb1 of the metal film MF1. Therefore, depending onthe degree of the flattening process to the lower surface MFb1 of themetal film MF1, the roughness Rz of the upper surface FLt of the framemember FLP becomes equal to or smaller than the roughness Rz of theupper surface MFt1 of the metal film MF1 in some cases as shown in anexample of FIG. 20.

Similarly, the roughness Rz of the lower surface FLb of the frame memberFLP can be reduced by reducing the roughness Rz of the upper surfaceMFt2 of the metal film MF2. Therefore, depending on the degree of theflattening process to the upper surface MFt2 of the metal film MF2, theroughness Rz of the lower surface FLb of the frame member FLP becomesequal to or smaller than the roughness Rz of the lower surface MFb2 ofthe metal film MF2 in some cases as shown in the example of FIG. 20.

Moreover, as described above, the metal film MF1 and the metal film MF2are press-bonded while the thermosetting resin component contained inthe resin member PPB is half-cured. For this reason, even when theroughness Rz of the upper surface FLt (and the lower surface FLb) of theframe member FLP is large as seen in, for example, a semiconductordevice PKG3 shown in FIG. 21, the peeling of the metal film MF1 (and themetal film MF2) can be suppressed. FIG. 21 is an enlargedcross-sectional view showing periphery of an upper surface and a lowersurface of a frame member included in a semiconductor device serving asa modified example of FIG. 20.

In an example shown in FIG. 21, the lower surface MFb1 of the metal filmMF1 (and the upper surface MFt2 of the metal film MF2) is subjected to aroughening treatment. For this reason, a roughness Rz of an uppersurface FLt (and a lower surface FLb) of a frame member FLP3 is about 7to 8 μm which is larger than the roughness Rz of the upper surface SR1 tof the insulating film SR1 shown in FIG. 4. However, since the metalfilm MF1 (and the metal film MF2) is press-bonded before the resincomponent contained in the resin member PPB (see FIG. 10) is cured, theresin component of the resin member PPB is easily buried into a gap inthe lower surface MFb1 of the metal film MF1 (and the upper surface MFt2of the metal film MF2). For this reason, the metal material is tightlyin contact with a portion having a small thickness of the resin RES inthe vicinity of the upper surface FLt (or the lower surface FLb) of theframe member FLP3. In other words, the portion having the smallthickness of the resin RES is reinforced by the metal material formingthe metal film MF1 (or the metal film MF2). Therefore, the portionhaving the small thickness of the resin RES is difficult to be damagedeven when the moisture is vaporized from the glass fibers GC shown inFIG. 21 in the frame member mounting process, the die bonding process,the ultraviolet-ray irradiation process or the solder ball mountingprocess shown in FIG. 7 explained in the first embodiment. Therefore, inthe case of the modified example shown in FIG. 21, the filtration of thebubbles into the upper surface FLt (or the lower surface FLb) of theframe member FLP can be suppressed more than the case in which thebonding material BND1 or BND2 is adhered to the frame member FLP3.

Moreover, from the viewpoint of suppressing oxidation of the metal filmMF1 and the metal film MF2, a mode in which the metal film MF1 and themetal film MF2 are not exposed as seen in a semiconductor device PKG4shown in FIG. 22 is preferable. FIG. 22 is an enlarged cross-sectionalview showing periphery of an upper surface and a lower surface of aframe member included in a semiconductor device serving as anothermodified example of FIG. 20. The metal film MF1 shown in FIG. 22 isdifferent from the metal film MF1 shown in FIG. 20 in that each of theouter side surface MFs1 and the inner side surface MFs2 is locatedbetween the outer side surface FLs1 and the inner side surface FLs2 ofthe frame member FLP when seen in a plan view and is covered with thebonding material BND2. Moreover, the metal film MF2 shown in FIG. 22 isdifferent from the metal film MF2 shown in FIG. 20 in that each of theouter side surface MFs3 and the inner side surface MFs4 is locatedbetween the outer side surface FLs1 and the inner side surface FLs2 ofthe frame member FLP when seen in a plan view and is covered with thebonding material BND1.

Each of the metal film MF1 and the metal film MF2 shown in FIG. 22 isobtained by selectively removing a part of each of the metal film MF1and the metal film MF2 in the metal film removing process (see FIG. 10)explained in the above-described embodiment. In the case of thesemiconductor device PKG4, since each of the metal film MF1 and themetal film MF2 is not exposed, oxidation of these metal film can besuppressed.

Moreover, in the case of the semiconductor device PKG4, a part (aportion continued to the outer side surface FLs1 and a portion continuedto the inner side surface FLs2) of the upper surface FLt of the framemember FLP is made in contact with the bonding material BND2. However,the gas generated by the vaporization of the moisture of the glassfibers GC preferentially flows toward a passage having a relativelysmall static pressure. Therefore, in the vicinity of the outer sidesurface FLs1 and in the vicinity of the inner side surface FLs2, the gasis easily discharged from the side surface of the frame member FLP. Thatis, a pressure to be applied to a portion that is made in tightlycontact with the bonding material BND2 in the upper surface FLt of theframe member FLP shown in FIG. 22 is small even when the moisture of theglass fibers GC is vaporized, and therefore the damage on the resin REScan be suppressed.

Although the overlapping explanation is omitted, the same goes for aportion made in tightly contact with the bonding material BND1 in thelower surface FLb of the frame member FLP.

Moreover, although the illustration is omitted, the frame member FLPshown in FIG. 22 may be replaced by a frame member FLP3 shown in FIG. 21as a modified example of the semiconductor device PKG4. In this case, asdescribed above, the pressure to be applied to the portion of the uppersurface FLt that is made in tightly contact with the bonding materialBND2 is small even when the moisture of the glass fibers GC isvaporized, and therefore, the damage on the resin RES can be suppressed.

In FIG. 19 to FIG. 22, note that the mode in which both of the metalfilm MF1 and the metal film MF2 are provided has been explained.However, as a modified example, either one of the metal film MF1 and themetal film MF2 may be provided. For example, as described above, themanufacturing processes of the semiconductor device include manyprocesses such as the heating process and the ultraviolet-rayirradiation process while the bonding material BND2 is disposed to behigher than the bonding material BND1. Therefore, when an act to preventthe peeling of the bonding material BND2 is preferentially taken, themetal film MF1 may be provided but the metal film MF2 may not beprovided, and the lower surface FLb of the frame member FLP may be madein tightly contact with the bonding material BND1. In this case, thethickness of the semiconductor package can be reduced by the metal filmMF2 that is only but still one layer.

Moreover, FIG. 19 to FIG. 22 show the metal film as the memberinterposed between the frame member FLP and the bonding material BND2and as the member interposed between the frame member FLP and thebonding material BND1. However, as seen in a semiconductor device PKG5shown in FIG. 23, a resin film NMF1 may be interposed between the framemember FLP and the bonding material BND2. FIG. 23 is an enlargedcross-sectional view showing periphery of an upper surface and a lowersurface of a frame member included in a semiconductor device serving asanother modified example of FIG. 20.

The semiconductor device PKG5 shown in FIG. 23 is different from thesemiconductor device PKG2 shown in FIG. 20 in that a resin film (member)NMF1 covering the upper surface FLt is interposed between the uppersurface FLt of the frame member FLP and the bonding material BND2.Moreover, the semiconductor device PKG5 shown in FIG. 23 is differentfrom the semiconductor device PKG2 shown in FIG. 20 in that a resin film(member) NMF2 covering the lower surface FLb is interposed between thelower surface FLb of the frame member FLP and the bonding material BND1.

The resin film NMF1 shown in FIG. 23 is obtained by performing the metalfilm removing process shown in FIG. 10, and then, applying and curing,for example, a liquid resin film NMF1 having a viscosity lower than thatof the bonding material BND2 shown in FIG. 15 on the upper surface FLtof the resin member PPB. Similarly, the resin film NMF2 is obtained byperforming the metal film removing process shown in FIG. 10, and then,applying and curing, for example, a liquid resin film NMF2 having aviscosity lower than that of the bonding material BND2 shown in FIG. 15on the lower surface FLb of the resin member PPB. Each of the resin filmNMF1 and the resin film NMF2 may contain, for example, a thermosettingresin or an ultraviolet-ray curable resin.

In the case of the semiconductor device PKG5 shown in FIG. 23, when theresin film is formed after removing the metal film, the number ofprocesses is larger than that of the frame member assembly processexplained by using FIG. 10 and FIG. 11. However, the resin film NMF1 ismore advantageous than the metal film MF1 shown in FIG. 20 in that theresin film NMF1 is difficult to be oxidized even when being exposed tothe outside. Moreover, even when the roughness Rz of the upper surfaceFLt is large as seen in the frame member FLP3 explained by using FIG.21, if a liquid resin having a low viscosity is used as the material forthe resin films NMF1 and NMF2, the resin can be buried intoirregularities of the upper surface FLt, and therefore, a portion havingthe small thickness of the resin RES is reinforced by the cured resinforming the resin films NMF1 and NMF2.

In the foregoing, the invention made by the present inventor has beenconcretely described based on the embodiments. However, it is needlessto say that the present invention is not limited to the foregoingembodiments and various modifications and alterations can be made withinthe scope of the present invention. While note that some modifiedexamples have been explained in the above-described embodiments, typicalmodified examples other than the modified examples explained in theabove-described embodiments will be explained below.

Modified Example 1

For example, the above-described first embodiment and second embodimenthave been explained by exemplifying the image sensor package in whichthe semiconductor chip serving as the image sensor is mounted on thewiring substrate as the example of the semiconductor device in which thesemiconductor chip is mounted on the wiring substrate and is surroundedby the frame member and the cover member. However, the invention isapplicable to, for example, not only the image sensor package but alsovarious modified examples as long as the same configuration as that ofthe semiconductor device explained in the first embodiment and thesecond embodiment is provided.

Modified Example 2

Moreover, for example, the above-described first embodiment and secondembodiment have been explained by exemplifying a mode in which the covermember CVG is the glass plate (including a plate having a reflectionpreventive film formed thereon). The glass plate is a generally knownmaterial as the cover member CVG in terms of its transparency to visiblelight and high heat resistance. However, the cover member CVG includesnot only the glass plate but also various modified examples. Forexample, even a plate comprised of resin can be used as the cover memberCVG in place of the glass plate as long as the plate is suitable fornecessary specifications of the transparency to visible light and theheat resistance.

Modified Example 3

Moreover, for example, in the modes explained in the above-describedfirst embodiment and second embodiment, the frame member FLP is formedby curing the prepreg material prepared by impregnating the glass fibersheet formed by molding the glass fibers GC into the sheet shape withthe resin RES that is the epoxy-based thermosetting resin as similar tothe above-described base member BSP. However, in the member having thecharacteristics of absorbing the peripheral moisture and of allowing themoisture to vaporize by the heating treatment and the ultraviolet-rayirradiation process, the same problems as the problems explained in thefirst embodiment or others occur in some cases. For example, the resinRES shown in FIG. 6 is explained as the thermosetting resin. However,the resin may be a resin such as a liquid crystal polymer and polyetherether ketone. Moreover, the resin RES may contain an additive materialsuch as carbon powder (carbon black) in addition to the above-describedmaterials.

Modified Example 4

Moreover, for example, various modified examples have been explained.However, a part or the entire of the above-explained modified examplescan be combined with one another and be applied within the consistentscope of the gist of the explanations about the respective modifiedexamples.

The above-described plurality of embodiments include the followingmodes.

(Additional Note 1)

A method of manufacturing a semiconductor device includes the followingsteps.

(a) a step of preparing a wiring substrate including a base member thathas a first upper surface and a first lower surface opposite to thefirst upper surface and that is comprised of an insulating material, afirst terminal formed on the first upper surface of the base member, anda first insulating film that has a second lower surface facing to thefirst upper surface and a second upper surface opposite to the secondlower surface and that is formed on the first upper surface such thatthe first terminal is exposed. Here, a frame member having a third lowersurface and a third upper surface opposite to the third lower surface isfixed on the second upper surface of the first insulating film via afirst bonding material while the second upper surface and the thirdlower surface face to each other, a first member covering the thirdupper surface is disposed on the third upper surface of the framemember, and the frame member is comprised of a first resin containingglass fibers.

(b) after the step (a), a step of fixing a semiconductor chip having amain surface that has a light-receiving part and a rear surface oppositeto the main surface, in a region surrounded by the frame member of thesecond upper surface via a die bonding material such that the rearsurface faces to the second upper surface; having a fourth lower surfaceand a fourth upper surface opposite to the fourth lower surface, on afifth upper surface of the first member via a second bonding materialsuch that the fourth lower surface faces to the second upper surface andsuch that the semiconductor chip is covered; and

(d) after the step (c), a step of curing the second bonding material byirradiating the second bonding material with an ultraviolet ray.

(Additional Note 2)

A semiconductor device includes: a wiring substrate; a frame member; asemiconductor chip; a cover member; and a first member. The wiringsubstrate includes: a base member having a first upper surface and afirst lower surface opposite to the first upper surface; a firstterminal formed on the first upper surface of the base member; and afirst insulating film having a second lower surface facing to the firstupper surface and a second upper surface opposite to the second lowersurface and being formed on the first upper surface such that the firstterminal is exposed. The frame member has a third lower surface and athird upper surface opposite to the third lower surface, and is fixed onthe second upper surface of the first insulating film of the wiringsubstrate via a first bonding material while the second upper surface ofthe first insulating film and the third lower surface face to eachother. The semiconductor chip has a main surface having alight-receiving part and a rear surface opposite to the main surface,and is mounted in a region surrounded by the frame member of the secondupper surface such that the rear surface faces to the second uppersurface of the first insulating film. The cover member has a fourthlower surface and a fourth upper surface opposite to the fourth lowersurface, and is mounted on the third upper surface of the frame membervia a second bonding material such that the fourth lower surface facesto the second lower surface of the first insulating film and such thatthe semiconductor chip is covered. The first member is interposedbetween the third upper surface of the frame member and the firstbonding material, and covers the third upper surface. The frame memberis comprised of a first resin with which glass fibers are impregnated.

What is claimed is:
 1. A method of manufacturing a semiconductor deviceincludes the following steps: (a) a step of preparing a wiring substrateincluding a base member that has a first upper surface and a first lowersurface opposite to the first upper surface and that is comprised of aninsulating material, a first terminal formed on the first upper surfaceof the base member, and a first insulating film that has a second lowersurface facing to the first upper surface and a second upper surfaceopposite to the second lower surface and that is formed on the firstupper surface such that the first terminal is exposed, wherein: a framemember having a third lower surface and a third upper surface oppositeto the third lower surface is fixed on the second upper surface of thefirst insulating film via a first bonding material while the secondupper surface and the third lower surface face to each other, a firstmember covering the third upper surface is disposed on the third uppersurface of the frame member, and the frame member is comprised of afirst resin containing glass fibers, (b) after the step (a), a step offixing a semiconductor chip having a main surface that has alight-receiving part and a rear surface opposite to the main surface, ina region surrounded by the frame member of the second upper surface viaa die bonding material such that the rear surface faces to the secondupper surface; having a fourth lower surface and a fourth upper surfaceopposite to the fourth lower surface, on a fifth upper surface of thefirst member via a second bonding material such that the fourth lowersurface faces to the second upper surface and such that thesemiconductor chip is covered; and (c) after the step (b), a step ofcuring the second bonding material by irradiating the second bondingmaterial with an ultraviolet ray.
 2. The method of manufacturing thesemiconductor device according to claim 1, wherein the step (a) includesthe steps of: (a1) immersing a glass fiber sheet in a resin layer suchthat the glass fiber sheet is impregnated with the first resin; (a2)after the step (a1), sandwiching a resin member containing the glassfiber sheet by a first metal film and a second metal film, andpress-bonding the first metal film, the second metal film and the resinmember with one another; and (a3) removing each of the first metal filmand the second metal film after the resin member has been cured suchthat the third upper surface and the third lower surface are exposed. 3.The method of manufacturing the semiconductor device according to claim1, wherein the wiring substrate includes a second terminal formed on thefirst lower surface of the base member, and the method further includesthe step of: (d) after the step (c), joining a solder ball to the secondterminal.
 4. The method of manufacturing the semiconductor deviceaccording to claim 1, wherein the first insulating film does not containthe glass fibers.